ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,117, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "In situ etch rate differentiation through oxidation" was invented by ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,118, issued on Aug. 25, was assigned to Semiconductor Manufacturing International (Beijing) Corp. (Beijing) and Semiconductor Manufacturing ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,119, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Carbon-based liner to reduce contac... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,120, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structures with impro... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,121, issued on Aug. 25, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was invented by S... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,122, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method for metal gapfill" was invented by Yi Xu (San... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,123, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Integration solution for NAND deep contact gap fill"... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,124, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Via alignment in single damascene structure"... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,125, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interconnect structure with dielect... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,126, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More